Thick Film High Power Chip Resistor - Aluminum Nitride Substrate(ALN) –CRP Series

Thick Film High Power Chip Resistor - Aluminum Nitride Substrate(ALN) –CRP Series Files Download

CRP series thick film resistor is designed on high thermal conductivity aluminum nitride substrate with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users’ circuit assembly. It offers effiectively heat dissipation to remove the heat to the overall performance of the devices. Enhance over 3 times more power in same size , Excellent reliability and stability. It offers High Thermal Conductivity for Power to 22 W with temperature control in 2512 Case ..

Features

• - Thick film resistive element on an aluminum nitride (AlN) substrates
• - Power ratings up to 22 W with active temperature control
• - Very high thermal conductivity in a small package size
• - Tolerance down to ± 1 % , TCR of ± 150 ppm/°C
• - Lead (Pb)-free wraparound termination over nickel barrie

Applications

• -High-power, surface-mount applications
• - industrial
• -Telecom systems ,RF loads in cell phone stations, radio coax circuits, transmitter terminations, and high-power amplifiers and networks

Files Download

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  CRP REV.A3--220615.pdf

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