AUTOMOBILANWENDUNGEN
Dünnschicht-Präzisionswiderstand 0,01%, TC2ppm, Drahtbondable, Antikorrosiv, MELF. Stromsensoren, Metall,...
WeiterlesenAbgeschirmter SMD-Leistungsinduktor (SCDS-Serie SCDS3D18NT150)
SCDS3D18NT150
Abgeschirmte SMD-Klein-, Miniatur-Leistungsdrossel, neu gestalteter Anschluss für geringe Kosten, flache Bauweise und hohe Strombelastbarkeit, magnetisch abgeschirmte Konstruktion. Ideal für digitale Geräte und Handsets.
SCDS Series3D18 ±30% 15μH 0.295 Ω 0.45A
| Größe | Toleranz | Induktivität | Testbedingungen | DCR (Ω) max. | IDC (A) |
|---|---|---|---|---|---|
| 3D18 | ±30% | 15 | 100KHz, 0.1V | 0.295 | 0.45 |
Spezifikationen für Tape und Reel (Einheit: mm)
| Type | Tape size | Parts Per Reel | ||
|---|---|---|---|---|
| W | P | 7" | 13" | |
| SCDS3D18 | 12 | 8 | 1000 | - |
| SCDS4D18 | 12 | 8 | - | 2000 |
| SCDS4D28 | 12 | 8 | - | 2000 |
| SCDS5D18 | 12 | 8 | - | 2000 |
| SCDS5D28 | 12 | 8 | - | 2000 |
| SCDS6D28 | 16 | 12 | - | 1500 |
| SCDS6D38 | 16 | 12 | - | 1000 |
Umweltspezifikationen für SMT-Leistungsinduktoren
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: <80% relative humidity. Recommended product should be used within one year from the time of delivery. |
Environmental Test
| Test Items | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% | Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. | |
| Humidity test | Temperature 40 ± 2°C, 90 ~ 95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. | |
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Test Items | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solder Ability Test | Terminal area must have 90% minimum solder coverage. | Dip pads in flux then dip in solder pot (SnCuNi) at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% | Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
Umformen
The Condition Of Reflow (Recommendation):
Code
- 150
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