
AUTOMOBILANWENDUNGEN
Dünnschicht-Präzisionswiderstand 0,01%, TC2ppm, Drahtbondbar, Antikorrosiv, MELF. Stromsensoren, Metall,...
WeiterlesenDrahtgewickelter Ferrit-Chip-Hochleistungsinduktor, kleine Größen, geschlossener magnetischer Kreis vermeidet Übersprechen, geeignet für hochdichte Installation und Reflow-Löten. Verwendet in allen Arten von elektronischen Geräten, Computern, Konvertern.
MLP Series1004 ±20% 1.5μH 0.072 Ω 3.4A 2.5A
Größe | Toleranz | Induktivität | Testbedingungen | DCR (Ω) max. | I sat (A) max. | I rms (A) max. |
---|---|---|---|---|---|---|
1004 | ±20% | 1.5 | 1MHz, 1V | 0.072 | 3.4 | 2.5 |
Electrical Performance Test
Item | Requirement | Test Method |
---|---|---|
Inductance | Refer to standard electrical characteristic spec. | HP4285A |
DC Resistance RDC | micro-ohm meter. | |
Isat | DC current will cause a 30% inductance reduction form initial value. | |
Irms | DC current will cause coil temp. rising to 40℃ whichever is smaller. |
Mechanical Performance Test
Item | Requirement | Test Method |
---|---|---|
Resistance to Soldering Heat | Appearance: No damage More than 95% of the terminal. Electrode should be covered with solder. Inductance: within ± 20% of initial value |
Flux: Rosin Solder Temperature: 260 ± 5°C Immersion Time: 10 ± 1 sec. |
Adhesive Test | No mechanical damage Soldering the products on PCB after the pulling test force>5N |
Reflow temperature: 245°C it shall be soldered on the substrate applying direction parallel to the substrate Apply force(F): 5 N Test time: 10 sec |
Temperature Cycle | No mechanical damage Inductance: within ± 20% of initial value |
Temperature: -50 ~ 125°C for 30 minutes each Cycle: 500cycles Measurement: at ambient temperature 24 hours after test completion |
Dry Heat Test | Temperature: 85 ± 2°C Testing time: 500 hrs Applied current: full rated current Measurement: at ambient temperature 24 hours after test completion |
|
Humidity Test | Temperature: 60 ± 2°C, Humidity: 90 ~ 95% RH Testing time: 500 hrs Applied current: full rated current Measurement: at ambient temperature 24 hours after test completion |
☑Storage Temperature: 5~40°C ; Humidity:<65%RH
Recommendable Reflow Soldering
Reel Specifications (Unit: mm)
Type | A | B | C | W | T | Quantity (EA) | ![]() |
---|---|---|---|---|---|---|---|
MLP03 | 178 ± 1 | 60.0 + 0.5 | 13.0 ± 0.2 | 9.00 ± 0.5 | 12.0 ± 0.15 | 3,000 | |
MLP05 | 178 ± 1 | 60.0 + 0.5 | 13.0 ± 0.2 | 9.00 ± 0.5 | 12.0 ± 0.15 | 3,000 | |
MLP(H)06 | 178 ± 1 | 60.0 + 0.5 | 13.0 ± 0.2 | 9.00 ± 0.5 | 12.0 ± 0.15 | 3,000 | |
MLP(H)04 | 178 ± 1 | 60.0 + 0.5 | 13.0 ± 0.2 | 9.00 ± 0.5 | 12.0 ± 0.15 | 3,000 | |
MLP(H)08 | 178 ± 1 | 60.0 + 0.5 | 13.0 ± 0.2 | 9.00 ± 0.5 | 12.0 ± 0.15 | 3,000 | |
MLP10 | 178 ± 1 | 60.0 + 0.5 | 13.0 ± 0.2 | 9.00 ± 0.5 | 12.0 ± 0.15 | 3,000 |
Tape Specifications (Unit: mm)
Type | A0 | B0 | K0 | t | ![]() |
---|---|---|---|---|---|
MLP03 | 1.45 ± 0.10 | 2.20 ± 0.10 | 1.12 ± 0.10 | 0.22 ± 0.05 | |
MLP05 | 1.45 ± 0.10 | 2.20 ± 0.10 | 1.12 ± 0.10 | 0.22 ± 0.05 | |
MLP06 | 1.80 ± 0.10 | 2.20 ± 0.10 | 1.15 ± 0.10 | 0.22 ± 0.05 | |
MLPH06 | 1.82 ± 0.05 | 2.23 ± 0.05 | 1.15 ± 0.05 | 0.22 ± 0.05 | |
MLP04 | 2.50 ± 0.10 | 3.00 ± 0.10 | 1.60 ± 0.10 | 0.25 ± 0.05 | |
MLPH04 | 2.25 ± 0.05 | 2.80 ± 0.10 | 1.35 ± 0.10 | 0.22 ± 0.05 | |
MLP08 | 2.50 ± 0.10 | 3.00 ± 0.10 | 1.60 ± 0.10 | 0.25 ± 0.05 | |
MLPH08 | 2.25 ± 0.05 | 2.80 ± 0.10 | 1.35 ± 0.10 | 0.22 ± 0.05 | |
MLP10 | 2.80 ± 0.10 | 3.45 ± 0.10 | 1.34 ± 0.10 | 0.23 ± 0.05 |
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