Mehrschichtige Chip-Perlen (CBM-Serie CBM03YTAN151)

Viking Tech hat Erfahrung in der Gestaltung innovativer Komponenten und bietet Unterstützung und Service für globale Kunden, die einen echten Fertigungspartner benötigen. Unser Ziel ist es, führend in Design, Fertigung und Vermarktung von Miniatur-, Präzisionspassivkomponenten zu sein, die in Automobil-, Industrie- und 3C-Elektronikanwendungen verwendet werden.

Mehrschichtige Chip-Perlen (CBM-Serie CBM03YTAN151)

CBM03YTAN151

Mehrschichtige Chip-Perlen (CBM-Serie CBM03YTAN151)
Mehrschichtige Chip-Perlen (CBM-Serie CBM03YTAN151) Files Download

Mehrschichtige Chipperle, die für EMI-Schutz, niedrigen Gleichstromwiderstand, hohe Löttemperaturbeständigkeit und verschiedene Größenverfügbarkeit für alle Arten von 4C-Anwendungen und verschiedenen elektronischen Geräten geeignet ist.
CBM Series±25% 4K/REEL 0.15 Ω 150Ω 400mA

ToleranzGehäuseTestbedingungDCR (Ω) max.Impedanz(Ω)Nennstrom (mA) max.
±25%4K/REEL100MHz0.15150400

Umwelteigenschaften

Electrical Performance Test

Item Specification Test Method
Impedance Refer to standard electrical spec. HP4286A
DCR HP 4338 digital mili-ohm meter

Mechanical Performance Test

Item Specification Test Method
Substrate Bending Test Without deformation cases
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
Test device shall be soldered on the substrate
Substrate Dimension: 100 x 40 x 0.8mm
Deflection: 3.0mm
Keeping Time: 10sec and then return
Substrate Bending Test - CBM Series
Vibration Appearance: No damage
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm (peak-peak)
Time: 2hrs for each axis (X, Y & Z), total 6hrs
Resistance to Soldering Heat No visible damage
Electrical characteristics and mechanical characteristics shall be satisfied
Solder temp: 265 ± 5°C
Immersion time: 6 ± 1sec
Preheating: 100°C to 150°C, 1 minute
Measured after exposure in the room condition for 24hrs
Solder: Sn-3Ag-0.5Cu
Solderability 95% min. coverage of all metabolized area Solder Temperature: 240 ± 5°C
Immersion Time: 3 ± 1sec
Solder: Sn-3Ag-0.5Cu
Terminal Strength Without deformation cases
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec
Terminal Strength - CBM Series
Temperature Cycle Appearance: No damage
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
One cycle:
One cycle/step1: -55 ± 3°C for 30 ± 3min
step2: standard atmospheric conditions 5s or less
step3:125 ± 2°C for 30 ± 3min
step4: standard atmospheric conditions 5s or less
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Humidity Resistance Temperature: 60 ± 2°C
Relative Humidity: 90 ~ 95%
Applied Current: Rated Current(maximum value)
Time: 1008 ± 12hrs
Measured after exposure in the room condition for 24hrs
High Temperature Resistance Temperature: 125 ± 2°C
Applied Current: Rated Current(maximum value)
Time: 1008 ± 12hrs
Measured after exposure in the room condition for 24hrs
Low Temperature Storage Life Test Temperature: -55 ± 2°C
Time: 1008 ± 12hrs
Measured after exposure in the room condition for 24hrs
Thermal Shock -55°C ~ 125°C kept stabilized for 30 minutes each for 100 cycles
Measured after exposure in the room condition for 24hrs

☑ Operating Temperature: -55°C ~ 125°C
☑ Storage Temperature: 15 ~ 28°C ; Humidity < 80%RH

Lötbedingungen

IR Reflow Soldering
(1) Time of IR reflow soldering at maximum temperature point 260°C: 10s
(2) Time of soldering iron at maximum temperature point 280°C: 3s

Verpackung

Packaging - CBM Series
Type Tape Dimensions Reel Dimensions Recommended Pattern Quantity
(EA)
A B T W P F K Tape
Type
A B C D A B C
CBM01 0.38 0.68 1.10 8.0 2.0 3.5 - B 178 60 10 2 0.25 0.69 0.32 15000
CBM02 0.65 1.15 0.80 8.0 2.0 3.5 - B 178 60 10 2 0.50 2.10 0.55 10000
CBM03 1.10 1.90 1.10 8.0 4.0 3.5 - B 178 60 10 2 0.60 2.60 0.80 4000
CBM05 1.55 2.30 1.20 8.0 4.0 3.5 - B 178 60 10 2 0.66 3.23 1.47 4000
CBM04 1.90 3.50 1.40 8.0 4.0 3.5 0.2 A 178 60 10 2 2.20 4.40 2.06 3000
CBM10 2.90 3.60 1.70 8.0 4.0 3.5 0.2 A 178 60 10 2 2.13 4.06 2.74 2000
CBM08 2.90 4.90 1.40 12 4.0 5.5 0.3 A 178 60 14 2 2.70 5.70 2.24 2000
CBM12 3.60 4.90 2.05 12 8.0 5.5 0.3 A 178 60 14 2 2.57 5.90 4.22 1000
CBM20 5.40 5.95 3.42 12 8.0 5.5 0.33 A 330 100 14.5 2 3.05 9.19 6.1 2000
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Viking Tech Corporation is Taiwan supplier and manufacturer in Zertifizierter HF-Induktor-Lieferant Viking has been offering our customers high quality Dünnschicht-Präzisionswiderstand, Stromsensorenwiderstand, RF-Keramikchip-Induktor, Leistungsinduktor, MELF-Dünnschichtwiderstand, Dickfilmwiderstand, MLCC, Mehrschicht-Chipkondensator, Chip-Perle, Leistungswiderstand, Antisulfur-Widerstand, Hochspannungswiderstand, Überspannungsschutz-Widerstand, Impuls-Widerstand. Widerstandsarray, bedrahteter Widerstand, Aluminium-Festelektrolytkondensator since 1997. With both advanced technology and 25 years experience, Viking always make sure to meet each customer's demand.


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