SMD 전원 인덕터 (SDIA 시리즈 SDIA0840MT330)
SDIA0840MT330
SMD 소형 파워 인덕터, 작은 크기와 낮은 프로필로 고전류에 대응하며 자기 차폐 구조를 갖추고 있습니다. LCD 디스플레이의 충격에 대한 강력한 구조, DC에서 DC로의 변환기, PDA의 작은 크기.
SDIA Series0840 ±20% 33μH 0.13 Ω 1.9A
| 크기 | 허용오차 | 인덕턴스 | 테스트 조건 | DCR (Ω) 최대. | IDC (A) |
|---|---|---|---|---|---|
| 0840 | ±20% | 33 | 1KHz, 0.25V | 0.13 | 1.9 |
테이프 및 릴 사양 (단위: mm)
| Type | Tape Size | Parts Per Reel | ||
|---|---|---|---|---|
| W | P | 7" | 13" | |
| SDIA0310 | 8 | 4 | 2000 | - |
| SDIA0312 | 8 | 4 | 2000 | - |
| SDIA0315 | 8 | 4 | 2000 | - |
| SDIA0410 | 12 | 8 | - | 5000 |
| SDIA0412 | 12 | 8 | - | 4500 |
| SDIA0415 | 12 | 8 | - | 3000 |
| SDIA0418 | 12 | 8 | - | 3000 |
| SDIA0420 | 12 | 8 | - | 3000 |
| SDIA0430 | 12 | 8 | - | 2500 |
| SDIA0520 | 12 | 8 | - | 2500 |
| SDIA0540 | 12 | 8 | - | 1500 |
| SDIA0620 | 12 | 8 | - | 2000 |
| SDIA0628 | 16 | 8 | - | 1500 |
| SDIA0645 | 16 | 12 | - | 1000 |
| SDIA0840 | 16 | 12 | - | 1000 |
SMT 전력 인덕터 환경 사양
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within 12 months from the time of delivery. |
Environmental Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
| Humidity test | Temperature 40 ± 2°C, 90~95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
리플로우
The Condition Of Reflow (Recommendation):
코드
- 330
- 파일 다운로드
-
VOS ARTICLES RÉCEMMENT VUS
베스트 세일
주요 제품
