다층 칩 비즈 (CBM 시리즈 CBM04YTHN601)
CBM04YTHN601
EMI 보호, 낮은 DC 저항, 높은 납땜 내열성, 다양한 크기 제공으로 모든 4C 응용 분야 및 다양한 전자 장비에 사용되는 다층 칩 비드.
CBM Series±25% 0.45 Ω 600Ω 300mA
허용오차 | 테스트 조건 | DCR (Ω) 최대. | 임피던스(Ω) | 정격 전류 (mA) 최대. |
---|---|---|---|---|
±25% | 100MHz | 0.45 | 600 | 300 |
환경 특성
Electrical Performance Test
Item | Specification | Test Method |
---|---|---|
Impedance | Refer to standard electrical spec. | HP4286A |
DCR | HP 4338 digital mili-ohm meter |
Mechanical Performance Test
Item | Specification | Test Method |
---|---|---|
Substrate Bending Test | Without deformation cases Impedance: within ± 30% of initial value DC Resistance shall be satisfied |
Test device shall be soldered on the substrate Substrate Dimension: 100 x 40 x 0.8mm Deflection: 3.0mm Keeping Time: 10sec and then return |
Vibration | Appearance: No damage Impedance: within ± 30% of initial value DC Resistance shall be satisfied |
Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm (peak-peak) Time: 2hrs for each axis (X, Y & Z), total 6hrs |
Resistance to Soldering Heat | No visible damage Electrical characteristics and mechanical characteristics shall be satisfied |
Solder temp: 265 ± 5°C Immersion time: 6 ± 1sec Preheating: 100°C to 150°C, 1 minute Measured after exposure in the room condition for 24hrs Solder: Sn-3Ag-0.5Cu |
Solderability | 95% min. coverage of all metabolized area | Solder Temperature: 240 ± 5°C Immersion Time: 3 ± 1sec Solder: Sn-3Ag-0.5Cu |
Terminal Strength | Without deformation cases Impedance: within ± 30% of initial value DC Resistance shall be satisfied |
Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec |
Temperature Cycle | Appearance: No damage Impedance: within ± 30% of initial value DC Resistance shall be satisfied |
One cycle: One cycle/step1: -55 ± 3°C for 30 ± 3min step2: standard atmospheric conditions 5s or less step3:125 ± 2°C for 30 ± 3min step4: standard atmospheric conditions 5s or less Total: 100cycles Measured after exposure in the room condition for 24hrs |
Humidity Resistance | Temperature: 60 ± 2°C Relative Humidity: 90 ~ 95% Applied Current: Rated Current(maximum value) Time: 1008 ± 12hrs Measured after exposure in the room condition for 24hrs |
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High Temperature Resistance | Temperature: 125 ± 2°C Applied Current: Rated Current(maximum value) Time: 1008 ± 12hrs Measured after exposure in the room condition for 24hrs |
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Low Temperature Storage Life Test | Temperature: -55 ± 2°C Time: 1008 ± 12hrs Measured after exposure in the room condition for 24hrs |
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Thermal Shock | -55°C ~ 125°C kept stabilized for 30 minutes each for 100 cycles Measured after exposure in the room condition for 24hrs |
☑ Operating Temperature: -55°C ~ 125°C
☑ Storage Temperature: 15 ~ 28°C ; Humidity < 80%RH
납땜 조건
(1) Time of IR reflow soldering at maximum temperature point 260°C: 10s
(2) Time of soldering iron at maximum temperature point 280°C: 3s
포장
Type | Tape Dimensions | Reel Dimensions | Recommended Pattern | Quantity (EA) |
||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
A | B | T | W | P | F | K | Tape Type |
A | B | C | D | A | B | C | ||
CBM01 | 0.38 | 0.68 | 1.10 | 8.0 | 2.0 | 3.5 | - | B | 178 | 60 | 10 | 2 | 0.25 | 0.69 | 0.32 | 15000 |
CBM02 | 0.65 | 1.15 | 0.80 | 8.0 | 2.0 | 3.5 | - | B | 178 | 60 | 10 | 2 | 0.50 | 2.10 | 0.55 | 10000 |
CBM03 | 1.10 | 1.90 | 1.10 | 8.0 | 4.0 | 3.5 | - | B | 178 | 60 | 10 | 2 | 0.60 | 2.60 | 0.80 | 4000 |
CBM05 | 1.55 | 2.30 | 1.20 | 8.0 | 4.0 | 3.5 | - | B | 178 | 60 | 10 | 2 | 0.66 | 3.23 | 1.47 | 4000 |
CBM04 | 1.90 | 3.50 | 1.40 | 8.0 | 4.0 | 3.5 | 0.2 | A | 178 | 60 | 10 | 2 | 2.20 | 4.40 | 2.06 | 3000 |
CBM10 | 2.90 | 3.60 | 1.70 | 8.0 | 4.0 | 3.5 | 0.2 | A | 178 | 60 | 10 | 2 | 2.13 | 4.06 | 2.74 | 2000 |
CBM08 | 2.90 | 4.90 | 1.40 | 12 | 4.0 | 5.5 | 0.3 | A | 178 | 60 | 14 | 2 | 2.70 | 5.70 | 2.24 | 2000 |
CBM12 | 3.60 | 4.90 | 2.05 | 12 | 8.0 | 5.5 | 0.3 | A | 178 | 60 | 14 | 2 | 2.57 | 5.90 | 4.22 | 1000 |
CBM20 | 5.40 | 5.95 | 3.42 | 12 | 8.0 | 5.5 | 0.33 | A | 330 | 100 | 14.5 | 2 | 3.05 | 9.19 | 6.1 | 2000 |
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