Multilayer Chip Beads (CBM Series CBM04YTHN601) Manufacturers

Multilayer Chip Beads (CBM Series CBM04YTHN601)

Send Inquiry Add to List

CBM04YTHN601

Multilayer Chip Beads (CBM Series CBM04YTHN601) Files Download

Multilayer chip bead that is for EMI protection , Low DC resistance, high soldering heat resistance , muliple size availability for all kind of 4C applications, various electronics euqipments.
CBM Series±25% 0.45 Ω 600Ω 300mA

Tolerance	Test Condition	DCR (Ω) max.	Impedance(Ω)	Rated Current (mA) max.
±25%	100MHz	0.45	600	300

Environmental Characteristics

Electrical Performance Test

Item	Specification	Test Method
Impedance	Refer to standard electrical spec.	HP4286A
DCR	Refer to standard electrical spec.	HP 4338 digital mili-ohm meter

Mechanical Performance Test

Item	Specification	Test Method
Substrate Bending Test	Without deformation cases Impedance: within ± 30% of initial value DC Resistance shall be satisfied	Test device shall be soldered on the substrate Substrate Dimension: 100 x 40 x 0.8mm Deflection: 3.0mm Keeping Time: 10sec and then return
Vibration	Appearance: No damage Impedance: within ± 30% of initial value DC Resistance shall be satisfied	Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm (peak-peak) Time: 2hrs for each axis (X, Y & Z), total 6hrs
Resistance to Soldering Heat	No visible damage Electrical characteristics and mechanical characteristics shall be satisfied	Solder temp: 265 ± 5°C Immersion time: 6 ± 1sec Preheating: 100°C to 150°C, 1 minute Measured after exposure in the room condition for 24hrs Solder: Sn-3Ag-0.5Cu
Solderability	95% min. coverage of all metabolized area	Solder Temperature: 240 ± 5°C Immersion Time: 3 ± 1sec Solder: Sn-3Ag-0.5Cu
Terminal Strength	Without deformation cases Impedance: within ± 30% of initial value DC Resistance shall be satisfied	Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec
Temperature Cycle	Appearance: No damage Impedance: within ± 30% of initial value DC Resistance shall be satisfied	One cycle: One cycle/step1: -55 ± 3°C for 30 ± 3min step2: standard atmospheric conditions 5s or less step3:125 ± 2°C for 30 ± 3min step4: standard atmospheric conditions 5s or less Total: 100cycles Measured after exposure in the room condition for 24hrs
Humidity Resistance		Temperature: 60 ± 2°C Relative Humidity: 90 ~ 95% Applied Current: Rated Current(maximum value) Time: 1008 ± 12hrs Measured after exposure in the room condition for 24hrs
High Temperature Resistance		Temperature: 125 ± 2°C Applied Current: Rated Current(maximum value) Time: 1008 ± 12hrs Measured after exposure in the room condition for 24hrs
Low Temperature Storage Life Test		Temperature: -55 ± 2°C Time: 1008 ± 12hrs Measured after exposure in the room condition for 24hrs
Thermal Shock		-55°C ~ 125°C kept stabilized for 30 minutes each for 100 cycles Measured after exposure in the room condition for 24hrs

☑ Operating Temperature: -55°C ~ 125°C
☑ Storage Temperature: 15 ~ 28°C ; Humidity < 80%RH

Soldering Condition

(1) Time of IR reflow soldering at maximum temperature point 260°C: 10s
(2) Time of soldering iron at maximum temperature point 280°C: 3s

Packaging

Type	Tape Dimensions								Reel Dimensions				Recommended Pattern			Quantity (EA)
Type	A	B	T	W	P	F	K	Tape Type	A	B	C	D	A	B	C	Quantity (EA)
CBM01	0.38	0.68	1.10	8.0	2.0	3.5	-	B	178	60	10	2	0.25	0.69	0.32	15000
CBM02	0.65	1.15	0.80	8.0	2.0	3.5	-	B	178	60	10	2	0.50	2.10	0.55	10000
CBM03	1.10	1.90	1.10	8.0	4.0	3.5	-	B	178	60	10	2	0.60	2.60	0.80	4000
CBM05	1.55	2.30	1.20	8.0	4.0	3.5	-	B	178	60	10	2	0.66	3.23	1.47	4000
CBM04	1.90	3.50	1.40	8.0	4.0	3.5	0.2	A	178	60	10	2	2.20	4.40	2.06	3000
CBM10	2.90	3.60	1.70	8.0	4.0	3.5	0.2	A	178	60	10	2	2.13	4.06	2.74	2000
CBM08	2.90	4.90	1.40	12	4.0	5.5	0.3	A	178	60	14	2	2.70	5.70	2.24	2000
CBM12	3.60	4.90	2.05	12	8.0	5.5	0.3	A	178	60	14	2	2.57	5.90	4.22	1000
CBM20	5.40	5.95	3.42	12	8.0	5.5	0.33	A	330	100	14.5	2	3.05	9.19	6.1	2000

Files Download

Data Sheet

Multilayer Chip Beads - CBM Series

SEARCH

Condition search: Cross Search

Best Sale

Multilayer Chip Beads (CBM Series CBM04YTHN601) Manufacturer - Viking

Based in Taiwan, Viking Tech Corporation is one of the prime Multilayer Chip Beads (CBM Series CBM04YTHN601) manufacturers since 1997. And their products are used throughout automotive, electronic device applications, with manufacturing tolerance down to 0.01% and TCR down to 2 ppm in a broad range of package sizes.

TS16949/ ISO9001/ ISO14001 and meet AEC-Q200 standards, Viking has been offering anti-sulfur, anti-surge, pulse, high voltage, high power precision resistors including thin/ thick film resistors, automotive resistors, melf resistors, current sense resistors, etc. Low noise, low TC, high power inductors such as rf inductors, chip inductors, power inductors, variable inductors, ferrite chip inductors, shielded inductors, wire wound inductors and dip inductors.

Multilayer Chip Beads (CBM Series CBM04YTHN601) has been offering customers high quality power resistors, power inductors and aluminum electrolytic capacitors with solid reputation. Both with advanced technology and 25 years of experience, Viking makes sure to meet each customer's demands.

View our quality products Power Inductor, Thin Film Chip Resistor, RF Inductor, Chip Resistor, current sense resistor, metal film, metal resistors, Thick film resistor, Chip Capacitor, Power Resistor and feel free to Contact Us.

Main Product

AUTOMOTIVE APPLICATIONS

Thin film Precision resistor 0.01%, TC2ppm, wirebondale, Anti-Crossive, MELF. Current sensing, Metal...

MEDICAL APPLICATIONS

Ceramic high frequency chip inductors, small size to 01005. Thin film, multilayer, wirewound , ferrite...

COMMUNICATION APPLICATIONS

Multilayer Ceramic capacitor offers high Voltage, high frequency, low noise, High Q, Low TCR. NPO, X7R,...

Multilayer Chip Beads (CBM Series CBM04YTHN601) Manufacturers - Viking

Multilayer Chip Beads (CBM Series CBM04YTHN601)