![自動車アプリケーション](https://cdn.ready-market.com.tw/cdb12976/Templates/pic/m/Promotion-Application-01.jpg?v=34c833ab)
自動車アプリケーション
薄膜精密抵抗器0.01%、TC2ppm、ワイヤボンダブル、防錆、MELF。 電流センシング、金属、抗硫黄、サージ、高電圧、TO220/247パッケージ最大100Wまで
続きを読むSMDミニチュアパワーインダクター、小型で低プロファイル、高電流に対応し、シールド構造による磁気。LCDディスプレイ、DCからDCコンバーター、PDAの小型化に対応した衝撃に強い構造。
SDIA Series0645 ±30% 3μH 0.024 Ω 5A
サイズ | 許容差 | インダクタンス | テスト条件 | DCR(Ω)の最大値 | IDC(A) |
---|---|---|---|---|---|
0645 | ±30% | 3 | 100KHz, 0.25V | 0.024 | 5 |
Type | Tape Size | Parts Per Reel | ||
---|---|---|---|---|
W | P | 7" | 13" | |
SDIA0310 | 8 | 4 | 2000 | - |
SDIA0312 | 8 | 4 | 2000 | - |
SDIA0315 | 8 | 4 | 2000 | - |
SDIA0410 | 12 | 8 | - | 5000 |
SDIA0412 | 12 | 8 | - | 4500 |
SDIA0415 | 12 | 8 | - | 3000 |
SDIA0418 | 12 | 8 | - | 3000 |
SDIA0420 | 12 | 8 | - | 3000 |
SDIA0430 | 12 | 8 | - | 2500 |
SDIA0520 | 12 | 8 | - | 2500 |
SDIA0540 | 12 | 8 | - | 1500 |
SDIA0620 | 12 | 8 | - | 2000 |
SDIA0628 | 16 | 8 | - | 1500 |
SDIA0645 | 16 | 12 | - | 1000 |
SDIA0840 | 16 | 12 | - | 1000 |
General
Item | Specification |
---|---|
Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within 12 months from the time of delivery. |
Environmental Test
Item | Specification | Test Conditions / Test Methods |
---|---|---|
High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
Humidity test | Temperature 40 ± 2°C, 90~95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
Item | Specification | Test Conditions / Test Methods |
---|---|---|
Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
The Condition Of Reflow (Recommendation):
薄膜精密抵抗器0.01%、TC2ppm、ワイヤボンダブル、防錆、MELF。 電流センシング、金属、抗硫黄、サージ、高電圧、TO220/247パッケージ最大100Wまで
続きを読む