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薄膜精密抵抗器0.01％、TC2ppm、ワイヤーボンダブル、防錆性、MELF。 電流センシング、金属、耐硫黄、サージ、高電圧、TO220/247パッケージ最大100Wまで
続きを読むDIPパワーインダクタ (DRGH シリーズ DRGH855KT681)
DRGH855KT681
ディップ高出力ワイヤ巻きインダクタ。
DRGH Series855 ±10% 680μH 3.25 Ω 0.32A
| サイズ | 公差 | インダクタンス | 試験条件 | DCR (Ω) 最大 | IDC (A) |
|---|---|---|---|---|---|
| 855 | ±10% | 680 | 1KHz, 0.1V | 3.25 | 0.32 |
DIPフェライトワイヤー巻き電源インダクタの信頼性
Mechanical Performance
| Item | Specification | Test Method |
|---|---|---|
| Vibration | Appearance: No damage L change: within ± 10% RDC: within specification |
Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs |
| Resistance to Soldering Heat | Appearance: No Damage | Pre-heating: 150°C, 1Min. Solder Composition: Sn / Ag / Cu = 95.6 / 3.0 / 0.5 Solder Temperature: 260 ± 5°C Immersion Time: 4 ± 1Sec. |
| Solderability | The electrodes shall be at least 90% covered with new solder coating. | Pre-heating: 150°C, 1min Solder Composition: Sn / Ag / Cu = 95.6 / 3.0 / 0.5 Solder Temperature: 245 ± 5°C Immersion Time: 4 ± 1sec |
Environmental Performance
| Item | Specification | Test Method | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Temperature Shock | Appearance: No damage L change: within ± 10% RDC: within specification |
10 cycles (Air to Air) 1 cycles shall consist of: 30 minutes exposure to –55 °C 30 minutes exposure to 125 °C 15 seconds maximum transition between temperatures |
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| Temperature Cycle | One cycle:
Total: 100cycles |
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| Humidity Resistance | Temperature: 40 ± 2°C Relative Humidity: 90 ~ 95% Time: 1000hrs Measured after exposure in the room condition for 24hrs |
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| Heat Temperature Resistance | Temperature: 85 ± 3°C Relative Humidity: 20% Applied Current: Rated Current Time: 1000hrs Measured after exposure in the room condition for 24hrs |
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| Low Temperature Resistance | Temperature: -25 ± 3°C Relative Humidity: 0% Time: 1000hrs Measured after exposure in the room condition for 24hrs |
☑ Storage Temperature: 15 ~ 28°C; < 80% RH
リフロー
パッケージング
| Type | Parts Plate | Parts Per Bind |
|---|---|---|
| DRGH664 | 200 | 2400 |
| DRGH855 | 200 | 2400 |
| DRGH875 | 200 | 2400 |
| DRGH895 | 200 | 2400 |
| DRGH110 | 144 | 1296 |
コード
- 681
- ファイルダウンロード
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