AUTOMOTIVE-ANWENDUNGEN
Dünnschicht-Präzisionswiderstand 0,01%, TC2ppm, Drahtbondage, Anti-Korrosiv, MELF. Stromerfassung,...
WeiterlesenAbgeschirmter SMD-Leistungsinduktor (PCDR-Serie PCDR0745MT470)
PCDR0745MT470
Abgeschirmte SMD-Leistungsinduktivität, kompakt, flach mit niedrigem DCR und hoher Strombelastbarkeit, magnetisch abgeschirmt gegen Strahlung.
PCDR Series0745 ±20% 47μH 0.125 Ω 0.75A
| Größe | Toleranz | Induktivität | Testbedingung | DCR (Ω) max. | IDC (A) |
|---|---|---|---|---|---|
| 0745 | ±20% | 47 | 1KHz, 0.5V | 0.125 | 0.75 |
Band- und Spulenspezifikationen (Einheit: mm)
| Type | Tape Size | Parts Per Reel | |
|---|---|---|---|
| W | P | 13" | |
| PCDR0628 | 16 | 12 | 1000 |
| PCDR0728 | 16 | 12 | 1000 |
| PCDR0730 | 16 | 12 | 1000 |
| PCDR0732 | 16 | 12 | 1000 |
| PCDR0745 | 16 | 12 | 1000 |
| PCDR1045 | 24 | 16 | 750 |
| PCDR1255 | 24 | 16 | 500 |
| PCDR1265 | 24 | 16 | 500 |
| PCDR1275 | 24 | 16 | 350 |
Umweltspezifikationen für SMD-Leistungsdrosseln
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within 12 months from the time of delivery. |
Environmental Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -40 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
| Humidity test | Temperature 40 ± 2°C, 90 ~ 95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
Reflow
The Condition Of Reflow (Recommendation):
Code
- 470
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