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Lees verderSMD-vermogensspoel (VLH-serie VLH322515C-6R8N)
VLH322515C-6R8N
SMD miniatuur vermogensspoel, klein formaat en laag profiel, op een speciale ferrietkern. Lage gelijkstroomweerstand, hoge stroomcapaciteit, hoge impedantiekenmerken, ze zijn uitstekend geschikt voor gebruik als smoorspoel in gelijkstroomvoedingcircuits.
VLH Series322515C ±30% 6.8μH 0.24 Ω 0.85A 0.85A
| Grootte | Tolerantie | Inductantie | Testconditie | DCR (Ω) max. | Ik zat (A) max. | I rms (A) max. |
|---|---|---|---|---|---|---|
| 322515C | ±30% | 6.8 | 1MHz, 0.1V | 0.24 | 0.85 | 0.85 |
Tape en Reel Specificaties (Eenheid: mm)
| Type | Tape Size | Parts Per Reel | ||
|---|---|---|---|---|
| W | P | 7" | 13" | |
| 252010E | 8 | 4 | 2000 | - |
| 252012E | 8 | 4 | 2000 | - |
| 252510 | 8 | 4 | 2000 | - |
| 322515 | 8 | 4 | 2000 | - |
| 322520 | 12 | 8 | 1000 | - |
| 453226 | 12 | 8 | 500 | - |
| 575047 | 16 | 12 | - | 1000 |
SMD Vermogen Inductor Milieu Specificaties
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within one year from the time of delivery. |
Environmental Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
| Humidity test | Temperature 40 ± 2°C, 90~95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
Opnieuw laten stromen
The Condition Of Reflow (Recommendation):
Code
- 6R8
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