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SDIA0410MT3R3
SMD-miniatuurvermogensinductor, klein formaat en laag profiel, geschikt voor hoge stroom, schildstructuur magnetisch. Sterke structuur tegen schokbestendigheid voor LCD-display, klein formaat DC naar DC-omzetters, PDA.
SDIA Series0410 ±20% 3.3μH 0.18 Ω 1.1A
| Grootte | Tolerantie | Inductantie | Testconditie | DCR (Ω) max. | IDC (A) |
|---|---|---|---|---|---|
| 0410 | ±20% | 3.3 | 100KHz, 0.25V | 0.18 | 1.1 |
Tape en Reel Specificaties (Eenheid: mm)
| Type | Tape Size | Parts Per Reel | ||
|---|---|---|---|---|
| W | P | 7" | 13" | |
| SDIA0310 | 8 | 4 | 2000 | - |
| SDIA0312 | 8 | 4 | 2000 | - |
| SDIA0315 | 8 | 4 | 2000 | - |
| SDIA0410 | 12 | 8 | - | 5000 |
| SDIA0412 | 12 | 8 | - | 4500 |
| SDIA0415 | 12 | 8 | - | 3000 |
| SDIA0418 | 12 | 8 | - | 3000 |
| SDIA0420 | 12 | 8 | - | 3000 |
| SDIA0430 | 12 | 8 | - | 2500 |
| SDIA0520 | 12 | 8 | - | 2500 |
| SDIA0540 | 12 | 8 | - | 1500 |
| SDIA0620 | 12 | 8 | - | 2000 |
| SDIA0628 | 16 | 8 | - | 1500 |
| SDIA0645 | 16 | 12 | - | 1000 |
| SDIA0840 | 16 | 12 | - | 1000 |
SMT Vermogen Inductor Milieu Specificaties
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within 12 months from the time of delivery. |
Environmental Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
| Humidity test | Temperature 40 ± 2°C, 90~95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
Opnieuw laten stromen
The Condition Of Reflow (Recommendation):
Code
- 3R3
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