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Lees verderChip Common Mode Choke (CM-serie CMH05MT670)
CMH05MT670
Chip common mode filter is een kleine chip-inductor met een ferrietkern en twee soorten draad gewikkeld. Zeer effectief bij het onderdrukken van ruis, met een hoge gemeenschappelijke modus impedantie in het ruisgebied en een lage differentiële modus impedantie in het signaalgebied, lage differentiële modus impedantie met een hoge koppelingsfactor. Er is bijna geen vervorming bij hoge snelheidssignalen. Typisch voor EMI-stralingsruisonderdrukking voor elektronische apparaten.
CM Series0805 ±20% 67μH 0.25 Ω 400mA 125V 10MΩ min.
| Grootte | Tolerantie | Inductantie | Testconditie | DCR (Ω) max. | IDC (mA) | Nominale spanning | Doorbraakspanning Vdc (V) | Isolatieweerstand (MΩ) min. |
|---|---|---|---|---|---|---|---|---|
| 0805 | ±20% | 67 | 100MHz | 0.25 | 400 | 50 | 125 | 10 |
Milieu Kenmerken
Electrical Performance Test
| Items | Requirement | Test Conditions / Test Methods |
|---|---|---|
| Impedance | Refer to standard electrical characteristic spec. Component should not be damaged |
LCR Meter HP 4291B |
| DC Resistance DCR | Micro-Ohm meter (GOM-801G) | |
| Withstand Voltage (VDC) | Test Voltage: 2.5 Times Rated Voltage Testing Time: 60 seconds Charge Current: 0.5mA |
|
| Rated Voltage (VDC) | Test Voltage: Rated Voltage Testing Time: 1 to 5 seconds Charge Current: 1mA |
|
| Insulation Resistance (I.R) | Charge Current: 1minute 10M ohm min. |
Mechanical Performance Test
| Items | Requirement | Test Conditions / Test Methods |
|---|---|---|
| Component Adhesion (Push Test) |
Base: 0805≧2 Lbs Cover: 0805≧1 Lbs Base: 1206≧4 Lbs Cover: 1206≧2 Lbs |
The component should be soldered (232°C± 5°C for 10 sec.) to tinned copper substrate Applied force gauge to the side of component It must withstand force of 2 or 4 pounds without failure of the component. |
| Drop | Component should not be damaged | Dropping chip by each side and corner. Drop 10 times in total Drop height: 100 cm Drop weight: 125 g |
| Solderability | The terminal should at least be 90% covered with solder | The component shall be dipped in a melted solder bath at 245 ±5℃ for 3 seconds |
| Vibration Test (Low Frequency) | Component should not be damaged | 1. Amplitude: 1.5 m/m 2. Frequency: 10-55-10Hz (1min.) 3. Direction: X, Y, Z 4. Duration: 2 Hrs/X, Y, Z |
Climatic Test
| Items | Requirement | Test Conditions / Test Methods |
|---|---|---|
| Low Temperature Storage | Impedance change: Within± 20% Without distinct damage in appearance |
1. Temp: -40 ±2°C 2. Time: 1000±48 Hours 3. Component should be tested after 1hour at room temperature |
| Thermal Shock |  Total: 5 Cycles |
|
| High Temperature Storage | 1. Temp: 85 ± 2°C 2. Time: 1000 ± 48 Hours 3. Component should be tested after 1hour at room temperature |
|
| Humidity | 1. Temp: 40 ± 2°C 2. R.H. : 90 ~ 95% 3. Time: 48 ±2 Hours |
|
| High Temperature Load Life | There should be no evidence of short or open circuit | 1. Temp: 85 ± 2°C 2. Time: 96 ± 12 Hours 3. Load: Allowed DC Current |
| Low Temperature Load Life | 1. Temp: -40 ± 2°C 2. Time: 96 ± 12 Hours 3. Load: Allowed DC Current |
Verpakking
Packaging Quantity & Reel Specifications
| Type | ΦA | ΦB | ΦC | W | T | Quantity (EA) |
|---|---|---|---|---|---|---|
| CMH05 | 178±2.0 | 60±0.5 | 13±0.3 | 9±0.3 | 11.4±1.0 | 2000 |
| CMH06 | 178±2.0 | 60±0.5 | 13±0.3 | 9±0.3 | 11.4±1.0 | 2000 |
Embossed Plastic Tape Specifications
| Type | A (mm) | B (mm) | W (mm) | E (mm) | F (mm) | P0 (mm) | P1 (mm) | P2 (mm) | ΦD0 (mm) | T (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
| CMH05 | 1.40±0.10 | 2.55±0.05 | 8.0±0.20 | 1.75±0.10 | 3.5±0.10 | 4.00±0.10 | 4.00±0.10 | 2.00±0.10 | 1.50+0.10 | 1.35±0.10 |
| CMH06 | 1.90±0.10 | 3.50±0.05 | 8.0±0.20 | 1.75±0.10 | 3.5±0.10 | 4.00±0.10 | 4.00±0.10 | 2.00±0.10 | 1.50+0.10 | 2.10±0.10 |
Peel-off Force
The force for tearing off cover tape is 0.05~0.69 (N) in the arrow direction at the following conditions:
Temperature: 5 ~ 35°C
Humidity: 45 ~ 85%
Atmospheric pressure: 860 ~ 1060hpa
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