고출력 박막 칩 저항기 (ARP 시리즈 ARP06DTD1132)
ARP06DTD1132
고출력 박막 칩 저항기 - ARP 시리즈
ARP Series1206 ±0.5% 50 1W Series11.3KΩ 5K/Reel
| 크기 | 허용오차 | TCR (ppm /℃) | 전력 | 저항 (옴) | 패키지 |
|---|---|---|---|---|---|
| 1206 | ±0.5% | 50 | 1W | 11.3K | 5K/Reel |
환경 특성
| Item | Requirement | Test Method | |
|---|---|---|---|
| Resistance<47Ω | Resistance≧47Ω | ||
| Temperature Coefficient of Resistance (T.C.R.) | As Spec. | JIS-C-5201-1 4.8 IEC-60115-1 4.8 +25/-55/+25/+125/+25°C |
|
| Short Time Overload(Power Operation Mode) | ΔR±0.4% | ΔR±0.2% | JIS-C-5201-1 4.13 IEC-60115-1 4.13 RCWV x 2.5 or Max. overload voltage whichever is lower for 5 seconds |
| Insulation Resistance | >1000 MΩ | JIS-C-5201-1 4.6 IEC-60115-1 4.6 Apply 100VDC for 1 minute |
|
| Endurance | ΔR±0.5% | ΔR±0.25% | JIS-C-5201-1 4.13 IEC-60115-1 4.13 70±2°C ,RCWV for 1000 hrs with 1.5hrs “ON” and 0.5 hr “OFF” |
| High Temperature Exposure | ΔR±0.25% | ΔR±0.1% | MIL-STD-202 Method 108 at +155°C for 1000 hrs |
| Biased Humidity | ΔR±0.25% | ΔR±0.1% | MIL-STD-202 Method 103 1000 hrs 85°C/85%RH 10% of operating power. |
| Temperature Cycling | ΔR±0.25% | ΔR±0.1% | JESD22 Method JA-104 -55°C to +125°C, 1000 cycles |
| Bending Strength (Board Flex) | ΔR±0.1% | IEC-60115-1 4.33 JIS-C-5201-1 6.1.4 Bending once for 60 seconds. Bending displacement 0805 size: 3mm |
|
| Solderability | 95% min. coverage | JIS-C-5201-1 4.17 IEC-60115-1 4.17 245± 5°C for 3 seconds |
|
| Resistance to Soldering Heat | ΔR±0.25% | ΔR±0.1% | JIS-C-5201-1 4.18 IEC-60115-1 4.18 260± 5°C for 10 seconds |
| Terminal strength | No broken | AEC-Q200-006 Force of 1.8kg for 60 seconds. |
|
| Mechanical Shock | ΔR±0.1% | MIL-STD-202 Method 213 Wave Form: Tolerance for half sine shock pulse. Peak value is 100g's. Normal duration (D) is 6. |
|
| Vibration | ΔR±0.1% | MIL-STD-202 Method 204 5 g's for 20 min., 12 cycles each of 3 orientations, 10-2000 Hz |
|
| ESD | Δ R± 0.5% | AEC-Q200-002 Human body model 1206: 1KV |
|
| Resistance to solvents | Marking Unsmeared | MIL-STD-202 Method 215 Add Aqueous wash chemical - OKEM Clean or equivalent. Do not use banned solvents. |
|
| Flammability | No ignition of the tissue paper or scorching or the pinewood board | UL-94 V-0 or V-1 are acceptable. Electrical test not required. |
|
| Sulfur Test | ΔR±0.1% | ASTM-B-809-95 105±2°C no power rating for 750 hrs |
|
RCWV (Rated continuous working voltage)= √(P x R) or Max. Operating voltage whichever is lower.
☑ Storage Temperature: 15 ~ 28°C; Humidity < 80%RH
☑ Shelf Life: 2 years from production date.
납땜 조건
(1) Time of IR reflow soldering at maximum temperature point 260°C：10s
(2) Time of wave soldering at maximum temperature point 260°C：10s
(3) Time of soldering iron at maximum temperature point 410°C：5s
마킹
1206 : 4 digits marking
Example:
| Resistance | 100Ω | 2.2KΩ | 10KΩ | 49.9KΩ | 100KΩ |
|---|---|---|---|---|---|
| Marking | 1000 | 2201 | 1002 | 4992 | 1003 |
포장
Packing Quantity & Reel Specifications (Unit :mm)
| Type | ØA | ØB | ØC | W | T | Paper Type(EA) | Emboss Plastic Tape(EA) |  |
|---|---|---|---|---|---|---|---|---|
| ARP06 | 178.0±1.0 | 60.0+1.0 | 13.5±0.7 | 9.5±1.0 | 11.5±1.0 | 5,000 | - |
Paper Tape Specifications
| Type | A | B | W | E | F | P0 | P1 | P2 | ΦD0 | T |
|---|---|---|---|---|---|---|---|---|---|---|
| ARP06 | 2.00±0.05 | 3.55±0.05 | 8.00±0.10 | 1.75±0.05 | 3.5±0.05 | 4.00±0.10 | 4.00±0.10 | 2.00±0.05 | 1.55±0.05 | 0.75±0.05 |
☑ Peel force of top cover tape
☑ The peel speed shall be about 300mm/min±5%
☑ The peel force of top cover tape shall be between 8gf to 60gf
코드
- 1132
- 파일 다운로드
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주요 제품
