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SMD電源インダクタ (SDIA シリーズ SDIA0620MT6R8)
SDIA0620MT6R8
SMDミニチュアパワーインダクター、小型で低プロファイル、高電流に対応し、シールド構造による磁気。LCDディスプレイ、DCからDCコンバーター、PDAの小型化に対応した衝撃に強い構造。
SDIA Series0620 ±20% 6.8μH 0.111 Ω 2.6A
サイズ | 許容差 | インダクタンス | テスト条件 | DCR(Ω)の最大値 | IDC(A) |
---|---|---|---|---|---|
0620 | ±20% | 6.8 | 100KHz, 0.25V | 0.111 | 2.6 |
テープおよびリール仕様(単位:mm)
![Tape Reel Specifications - SDIA Series](/Templates/pic/IMG-SDIA-Tape-Reel-Specifications.jpg)
Type | Tape Size | Parts Per Reel | ||
---|---|---|---|---|
W | P | 7" | 13" | |
SDIA0310 | 8 | 4 | 2000 | - |
SDIA0312 | 8 | 4 | 2000 | - |
SDIA0315 | 8 | 4 | 2000 | - |
SDIA0410 | 12 | 8 | - | 5000 |
SDIA0412 | 12 | 8 | - | 4500 |
SDIA0415 | 12 | 8 | - | 3000 |
SDIA0418 | 12 | 8 | - | 3000 |
SDIA0420 | 12 | 8 | - | 3000 |
SDIA0430 | 12 | 8 | - | 2500 |
SDIA0520 | 12 | 8 | - | 2500 |
SDIA0540 | 12 | 8 | - | 1500 |
SDIA0620 | 12 | 8 | - | 2000 |
SDIA0628 | 16 | 8 | - | 1500 |
SDIA0645 | 16 | 12 | - | 1000 |
SDIA0840 | 16 | 12 | - | 1000 |
SMTパワーインダクタの環境仕様
General
Item | Specification |
---|---|
Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within 12 months from the time of delivery. |
Environmental Test
Item | Specification | Test Conditions / Test Methods |
---|---|---|
High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
Humidity test | Temperature 40 ± 2°C, 90~95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
Item | Specification | Test Conditions / Test Methods |
---|---|---|
Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
リフロー
The Condition Of Reflow (Recommendation):
![The Condition Of Reflow](/Templates/pic/IMG-SDIA-The-Condition-Of-Reflow.jpg)
コード
- 6R8
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