High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300)

High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300) / Viking Tech has the experience in the design of innovative components, offering support and service to Global customers that demand a genuine manufacturing partner. Our goal is to be the leader in design, manufacturing, and marketing of miniature, precision passive components used throughout Automotive, Industrial and 3C electronic applications.

High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300)

ARP06FTC3300

High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300)
High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300) Files Download

High Power Thin Film Chip Resistor - ARP Series
ARP Series1206 ±1% 25 1W Series330Ω 5K/Reel

SizeToleranceTCR (ppm /℃)PowerResistance (Ohm)Package
1206±1%251W3305K/Reel

Environmental Characteristics

Item Requirement Test Method
Resistance<47Ω Resistance≧47Ω
Temperature Coefficient of Resistance (T.C.R.) As Spec. JIS-C-5201-1 4.8
IEC-60115-1 4.8
+25/-55/+25/+125/+25°C
Short Time Overload(Power Operation Mode) ΔR±0.4% ΔR±0.2% JIS-C-5201-1 4.13
IEC-60115-1 4.13
RCWV x 2.5 or Max. overload voltage whichever is lower for 5 seconds
Insulation Resistance >1000 MΩ JIS-C-5201-1 4.6
IEC-60115-1 4.6
Apply 100VDC for 1 minute
Endurance ΔR±0.5% ΔR±0.25% JIS-C-5201-1 4.13
IEC-60115-1 4.13
70±2°C ,RCWV for 1000 hrs with 1.5hrs “ON” and 0.5 hr “OFF”
High Temperature Exposure ΔR±0.25% ΔR±0.1% MIL-STD-202 Method 108
at +155°C for 1000 hrs
Biased Humidity ΔR±0.25% ΔR±0.1% MIL-STD-202 Method 103
1000 hrs 85°C/85%RH 10% of operating power.
Temperature Cycling ΔR±0.25% ΔR±0.1% JESD22 Method JA-104
-55°C to +125°C, 1000 cycles
Bending Strength (Board Flex) ΔR±0.1% IEC-60115-1 4.33
JIS-C-5201-1 6.1.4
Bending once for 60 seconds. Bending displacement 0805 size: 3mm
Solderability 95% min. coverage JIS-C-5201-1 4.17
IEC-60115-1 4.17
245± 5°C for 3 seconds
Resistance to Soldering Heat ΔR±0.25% ΔR±0.1% JIS-C-5201-1 4.18
IEC-60115-1 4.18
260± 5°C for 10 seconds
Terminal strength No broken AEC-Q200-006
Force of 1.8kg for 60 seconds.
Mechanical Shock ΔR±0.1% MIL-STD-202 Method 213
Wave Form: Tolerance for half sine shock pulse.
Peak value is 100g's. Normal duration (D) is 6.
Vibration ΔR±0.1% MIL-STD-202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations,
10-2000 Hz
ESD Δ R± 0.5% AEC-Q200-002
Human body model
1206: 1KV
Resistance to solvents Marking Unsmeared MIL-STD-202 Method 215
Add Aqueous wash chemical - OKEM Clean or equivalent. Do not use banned solvents.
Flammability No ignition of the tissue paper or scorching or the pinewood board UL-94
V-0 or V-1 are acceptable. Electrical test not required.
Sulfur Test ΔR±0.1% ASTM-B-809-95
105±2°C no power rating for 750 hrs

RCWV (Rated continuous working voltage)= √(P x R) or Max. Operating voltage whichever is lower.
☑ Storage Temperature: 15 ~ 28°C; Humidity < 80%RH
☑ Shelf Life: 2 years from production date.

Soldering Condition

IR Reflow Soldering / Wave Soldering (Flow Soldering)
(1) Time of IR reflow soldering at maximum temperature point 260°C:10s
(2) Time of wave soldering at maximum temperature point 260°C:10s
(3) Time of soldering iron at maximum temperature point 410°C:5s

Marking

1206 : 4 digits marking

Example:

Resistance 100Ω 2.2KΩ 10KΩ 49.9KΩ 100KΩ
Marking 1000 2201 1002 4992 1003

Packaging

Packing Quantity & Reel Specifications (Unit :mm)

Type ØA ØB ØC W T Paper Type(EA) Emboss Plastic Tape(EA) Packing Quantity & Reel Specifications
ARP06 178.0±1.0 60.0+1.0 13.5±0.7 9.5±1.0 11.5±1.0 5,000 -

Paper Tape Specifications

Paper Tape Specifications
Type A B W E F P0 P1 P2 ΦD0 T
ARP06 2.00±0.05 3.55±0.05 8.00±0.10 1.75±0.05 3.5±0.05 4.00±0.10 4.00±0.10 2.00±0.05 1.55±0.05 0.75±0.05

☑ Peel force of top cover tape
☑ The peel speed shall be about 300mm/min±5%
☑ The peel force of top cover tape shall be between 8gf to 60gf

Paper Tape Specifications

Code

  • 3300
Files Download
  • Data Sheet
    Data Sheet

    High Power Thin Film Precision Chip Resistor - ARP Series




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High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300) Manufacturer - Viking

Based in Taiwan, Viking Tech Corporation is one of the prime High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300) manufacturers since 1997. And their products are used throughout automotive, electronic device applications, with manufacturing tolerance down to 0.01% and TCR down to 2 ppm in a broad range of package sizes.

TS16949/ ISO9001/ ISO14001 and meet AEC-Q200 standards, Viking has been offering anti-sulfur, anti-surge, pulse, high voltage, high power precision resistors including thin/ thick film resistors, automotive resistors, melf resistors, current sense resistors, etc. Low noise, low TC, high power inductors such as rf inductors, chip inductors, power inductors, variable inductors, ferrite chip inductors, shielded inductors, wire wound inductors and dip inductors.

High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300) has been offering customers high quality power resistors, power inductors and aluminum electrolytic capacitors with solid reputation. Both with advanced technology and 25 years of experience, Viking makes sure to meet each customer's demands.

High Power Thin Film Chip Resistor (ARP Series ARP06FTC3300) has been offering customers high quality power resistors, power inductors and aluminum electrolytic capacitors with solid reputation. Both with advanced technology and 25 years of experience, Viking makes sure to meet each customer's demands.


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