High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750) Manufacturers

High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750)

ARP06BTC0750

High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750) Files Download

High Power Thin Film Chip Resistor - ARP Series
ARP Series1206 ±0.1% 25 1W Series75Ω 5K/Reel

Size	Tolerance	TCR (ppm /℃)	Power	Resistance (Ohm)	Package
1206	±0.1%	25	1W	75	5K/Reel

Environmental Characteristics

Item	Requirement		Test Method
Item	Resistance<47Ω	Resistance≧47Ω	Test Method
Temperature Coefficient of Resistance (T.C.R.)	As Spec.		JIS-C-5201-1 4.8 IEC-60115-1 4.8 +25/-55/+25/+125/+25°C
Short Time Overload(Power Operation Mode)	ΔR±0.4%	ΔR±0.2%	JIS-C-5201-1 4.13 IEC-60115-1 4.13 RCWV x 2.5 or Max. overload voltage whichever is lower for 5 seconds
Insulation Resistance	>1000 MΩ		JIS-C-5201-1 4.6 IEC-60115-1 4.6 Apply 100VDC for 1 minute
Endurance	ΔR±0.5%	ΔR±0.25%	JIS-C-5201-1 4.13 IEC-60115-1 4.13 70±2°C ,RCWV for 1000 hrs with 1.5hrs “ON” and 0.5 hr “OFF”
High Temperature Exposure	ΔR±0.25%	ΔR±0.1%	MIL-STD-202 Method 108 at +155°C for 1000 hrs
Biased Humidity	ΔR±0.25%	ΔR±0.1%	MIL-STD-202 Method 103 1000 hrs 85°C/85%RH 10% of operating power.
Temperature Cycling	ΔR±0.25%	ΔR±0.1%	JESD22 Method JA-104 -55°C to +125°C, 1000 cycles
Bending Strength (Board Flex)	ΔR±0.1%		IEC-60115-1 4.33 JIS-C-5201-1 6.1.4 Bending once for 60 seconds. Bending displacement 0805 size: 3mm
Solderability	95% min. coverage		JIS-C-5201-1 4.17 IEC-60115-1 4.17 245± 5°C for 3 seconds
Resistance to Soldering Heat	ΔR±0.25%	ΔR±0.1%	JIS-C-5201-1 4.18 IEC-60115-1 4.18 260± 5°C for 10 seconds
Terminal strength	No broken		AEC-Q200-006 Force of 1.8kg for 60 seconds.
Mechanical Shock	ΔR±0.1%		MIL-STD-202 Method 213 Wave Form: Tolerance for half sine shock pulse. Peak value is 100g's. Normal duration (D) is 6.
Vibration	ΔR±0.1%		MIL-STD-202 Method 204 5 g's for 20 min., 12 cycles each of 3 orientations, 10-2000 Hz
ESD	Δ R± 0.5%		AEC-Q200-002 Human body model 1206: 1KV
Resistance to solvents	Marking Unsmeared		MIL-STD-202 Method 215 Add Aqueous wash chemical - OKEM Clean or equivalent. Do not use banned solvents.
Flammability	No ignition of the tissue paper or scorching or the pinewood board		UL-94 V-0 or V-1 are acceptable. Electrical test not required.
Sulfur Test	ΔR±0.1%		ASTM-B-809-95 105±2°C no power rating for 750 hrs

RCWV (Rated continuous working voltage)= √(P x R) or Max. Operating voltage whichever is lower.
☑ Storage Temperature: 15 ~ 28°C; Humidity < 80%RH
☑ Shelf Life: 2 years from production date.

Soldering Condition

IR Reflow Soldering / Wave Soldering (Flow Soldering)

(1) Time of IR reflow soldering at maximum temperature point 260°C：10s
(2) Time of wave soldering at maximum temperature point 260°C：10s
(3) Time of soldering iron at maximum temperature point 410°C：5s

Marking

1206 : 4 digits marking

Example:

Resistance	100Ω	2.2KΩ	10KΩ	49.9KΩ	100KΩ
Marking	1000	2201	1002	4992	1003

Packaging

Packing Quantity & Reel Specifications (Unit :mm)

Type	ØA	ØB	ØC	W	T	Paper Type(EA)	Emboss Plastic Tape(EA)
ARP06	178.0±1.0	60.0+1.0	13.5±0.7	9.5±1.0	11.5±1.0	5,000	-

Paper Tape Specifications

Type	A	B	W	E	F	P0	P1	P2	ΦD₀	T
ARP06	2.00±0.05	3.55±0.05	8.00±0.10	1.75±0.05	3.5±0.05	4.00±0.10	4.00±0.10	2.00±0.05	1.55±0.05	0.75±0.05

☑ Peel force of top cover tape
☑ The peel speed shall be about 300mm/min±5%
☑ The peel force of top cover tape shall be between 8gf to 60gf

Code

0750

Files Download

Data Sheet
High Power Thin Film Precision Chip Resistor - ARP Series

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High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750) Manufacturer - Viking

Based in Taiwan, Viking Tech Corporation is one of the prime High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750) manufacturers since 1997. And their products are used throughout automotive, electronic device applications, with manufacturing tolerance down to 0.01% and TCR down to 2 ppm in a broad range of package sizes.

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High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750) Manufacturers - Viking

High Power Thin Film Chip Resistor (ARP Series ARP06BTC0750)