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Résistance de précision en film mince 0,01 %, TC2ppm, wirebondale, anti-corrosion, MELF. Détection...
Lire la suiteSelf d'alimentation SMD, bobines à fil plat pour grande intensité adaptable, faible élévation de température à grande intensité, profil bas pour faible DCR.
SDB Series1350 ±20% 0.1μH 6 Ω 118A 55A
Taille | Tolérance | Inductance | Condition de test | DCR (Ω) max. | IDC (A) | Courant de montée en température (A) |
---|---|---|---|---|---|---|
1350 | ±20% | 0.1 | 100KHz, 0.25V | 6 | 118 | 55 |
Type | Tape size | Parts Per Reel | |
---|---|---|---|
W | P | 13" | |
SDB0420 | 12 | 8 | 3500 |
SDB0520 | 12 | 8 | 3000 |
SDB0530 | 12 | 8 | 2500 |
SDB0620 | 16 | 12 | 2000 |
SDB0625 | 16 | 12 | 2000 |
SDB0630 | 16 | 12 | 1500 |
SDB0650 | 16 | 12 | 800 |
SDB1040 | 24 | 16 | 800 |
SDB1340 | 24 | 16 | 500 |
SDB1350 | 24 | 16 | 500 |
SDB1365 | 24 | 16 | 500 |
Item | Requirement | Test Method | ||||||||||||||
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Solderability | More than 90% of the terminal electrode should be covered with solder. | 230 ± 5°C for 4 ± 1 seconds. | ||||||||||||||
Solder Heat Resistance | Inductance within ± 20% of initial value. |
260 ± 5°C for 10 ± 1 seconds. | ||||||||||||||
Heat Resistance | Temperature: 125 ± 5°C Time: 500 hours Tested after 2 hour at room temperature. |
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Cold Resistance | Temperature: -40 ± 5°C Time: 500 hours Tested after 2 hour at room temperature. |
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Thermal Shock | One cycle:
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Humidity Resistance | Temperature: 40 ± 2°C, 90 ~ 95% relative humidity. Time: 500 hours. Tested after 2 hour at room temperature. |
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Vibration Test | Inductance within ± 5% of initial value. The appearance shall not break. |
After vibration for 1hour, in each of three orientations at sweep vibration (10 ~ 55 ~ 10Hz) with 1.52mm P-P amplitudes. |
The Condition Of Reflow (Recommendation):
Résistance de précision en film mince 0,01 %, TC2ppm, wirebondale, anti-corrosion, MELF. Détection...
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