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Résistance de précision en film mince 0,01 %, TC2ppm, wirebondale, anti-corrosion, MELF. Détection...
Lire la suiteInductance de puissance CMS blindée (Série SCDS SCDS4D28NT6R8)
SCDS4D28NT6R8
Inducteur de puissance SMD blindé, petit et miniature, avec une nouvelle conception pour un coût réduit, un profil bas et un courant élevé, construction à blindage magnétique. Idéal pour les équipements numériques et les téléphones portables.
SCDS Series4D28 ±30% 6.8μH 0.109 Ω 1.12A
| Taille | Tolérance | Inductance | Condition de test | DCR (Ω) max. | IDC (A) |
|---|---|---|---|---|---|
| 4D28 | ±30% | 6.8 | 100KHz, 0.1V | 0.109 | 1.12 |
Spécifications de bande et de bobine (Unité : mm)
| Type | Tape size | Parts Per Reel | ||
|---|---|---|---|---|
| W | P | 7" | 13" | |
| SCDS3D18 | 12 | 8 | 1000 | - |
| SCDS4D18 | 12 | 8 | - | 2000 |
| SCDS4D28 | 12 | 8 | - | 2000 |
| SCDS5D18 | 12 | 8 | - | 2000 |
| SCDS5D28 | 12 | 8 | - | 2000 |
| SCDS6D28 | 16 | 12 | - | 1500 |
| SCDS6D38 | 16 | 12 | - | 1000 |
Spécifications environnementales de l'inducteur de puissance SMT
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: <80% relative humidity. Recommended product should be used within one year from the time of delivery. |
Environmental Test
| Test Items | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% |
Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
|
| Humidity test | Temperature 40 ± 2°C, 90 ~ 95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. |
|
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Test Items | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solder Ability Test | Terminal area must have 90% minimum solder coverage. | Dip pads in flux then dip in solder pot (SnCuNi) at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% |
Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
Refusion
The Condition Of Reflow (Recommendation):
Code
- 6R8
- Téléchargement de fichiers
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Produit Principal
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